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land grid array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket rather than the integrated circuit.〔(【引用サイトリンク】url=http://www.pcmag.com/encyclopedia/term/60329/lga )〕 An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
==Description==
The ''land grid array'' is a packaging technology with a square grid of contacts on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste.
LGA packaging is related to ball grid array (BGA) and pin grid array (PGA) packaging. Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls, and use flat contacts which are soldered directly to the PCB. BGA packages, however have balls as their contacts in between the IC and the PCBs. The balls are normally attached to the underside of the IC.
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
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